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2011 International Conference on Advanced Material Research - ICAMR 2011

来源:中国论文联盟  作者:张老师 [字体: ]
2011 International Conference on Advanced Material Research - ICAMR 2011

Welcome to the official website of the 2011 International Conference on Advanced Material Research, ICAMR 2011, will be held during 21-23 January 2011, in Chongqing, China. ICAMR 2011, aims to bring together researchers, scientists, engineers, and scholar students to exchange and share thEir experiences, new ideas, and research results about all aspects of Advanced Material Research, and discuss the practical challenges encountered and the solutions adopted.

The conference will be held every year to make it an ideal platform for people to share views and experiences in Security Science and Technology and related areas. All accepted papers of ICAMR 2011 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.

ICAMR所有录用并注册的论文发表在Advanced Materials Research (ISSN: 1022-6680) 期刊上,并被Ei Compendex检索。

Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

English is the official language of the conference. We welcome paper submissions. Prospective authors are invited to submit full (and original research) papers (which is NOT submitted/published/under consideration anywhere in other conferences/journal) in electronic (PDF only) format through the easy chair conferences management system website or via email icamr@vip.163.com.

Disclaimer: The content of the website is subject to change. The information on hyper linked or referred to web sites is neither investigated nor analyzed by the conference organizers. No warranty or representation, express or implied, is given as to the accuracy or completeness of that information. In no event will the conference organizers accept any liability with regard to the information contained in this web site or any other hyper linked or referred to web sites.

Call for Papers

2011 International Conference on Advanced Material Research (ICAMR 2011) is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Advanced Material Research. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to:

    (01) Materials behavior

    (02) Casting and solidification

    (03) Powder metallurgy and ceramic forming

    (04) Surface, subsurface, and interface phenomena

    (05) Coatings and surface engineering

    (06) Composite materials

    (07) Materials forming

    (08) Machining

    (09) Nanomaterials and nanomanufacturing

    (10) Biomedical manufacturing

    (11) Environmentally sustainable manufacturing processes and systems

    (12) Manufacturing process planning and scheduling

    (13) Meso/micro manufacturing equipment and processes

    (14) Modeling, analysis, and simulation of manufacturing processes

    (15) Computer-aided design, manufacturing, and engineering

    (16) Semiconductor materials manufacturing

    (17) Laser based manufacturing

    (18) Precision molding processes

    (19) Joining processes

    (20) Rapid manufacturing technologies

    (21) Nontraditional manufacturing

    (22) Nanofabrication, nanometrology and applications

    (23) Metrology and measurement

All accepted papers of ICAMR 2011 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.

ICAMR所有录用并注册的论文将发表在Advanced Materials Research (ISSN: 1022-6680) 期刊上,并被Ei Compendex检索。

Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

IN CHINESE (中国作者投稿指南)

大会的官方语言英语,请务必用英语撰写论文。
请严格按照模板的格式编排(最好是在模板的基础上替换原文内容)。全文长度不得少于4页。
Word 模板:
NEW_AuthorInstructions.rtf

Important Date

Paper Submission (Full Paper)                                                   Before August 25, 2010
Notification of Acceptance                                                         On September 15, 2010
Final Paper Submission                                                             Before October 5, 2010
Authors' Registration                                                                  Before October 5, 2010
ICAMR 2011 Conference Dates                                                    January 21 - 23, 2011

About Chongqing

From Wikipedia, the free encyclopedia


Chongqing's Skyline


The Great Hall of the People at night.


Location of the Municipality of Chongqing within China

Chongqing (simplified Chinese: 重庆; traditional Chinese: 重慶; pinyin: Chóngqìng; Postal map spelling: Chungking; Wade-Giles: Ch'ung-ch'ing) is a major city in central-western China. Administratively, it is one of the People's Republic of China's four provincial-level municipalities, and the only such municipality in western China. The municipality was created on 14 March 1997, succeeding the sub-provincial city administration that was part of Sichuan Province. The municipality of Chongqing has a registered population of 31,442,300 as of 2005.[1] The boundaries of Chongqing municipality reach much farther into the city's hinterland than the boundaries of the other three provincial level municipalities (Beijing, Shanghai and Tianjin), and much of its administrative area, which spans over 80 000 km², is rural. It has jurisdiction over 19 districts, 17 counties, and four autonomous counties. The population of the urban area of Chongqing proper was 5.09 million (2000).[2]

The municipal abbreviation, Yú (渝), was approved by the State Council on 18 April 1997. Chongqing was also a municipality of the Republic of China administration, serving as its wartime capital during the Second Sino-Japanese War. Its abbreviated name is derived from the old name of a part of the Jialing River that runs through Chongqing and feeds the Yangtze River.

2011 International Conference on Advanced Material Research - ICAMR 2011 Committees

All accepted papers of ICAMR 2011 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.

ICAMR 2011 所有录用并注册的论文将发表在Advanced Materials Research (ISSN: 1022-6680) 期刊上,并被Ei Compendex检索。

1、本次会议录用论文全部发表在Advanced Materials Research (EI和ISTP收录) 正刊上 (查阅:TTP会议列表, TTP最新消息).
2、本次会议确保论文在会前出版,会议期间发放论文集给参会者,可以大大缩短出版以及索引周期。

  Registration Fee
Authors (IACSIT)*: 400 USD
Authors (Student)* 400 USD
Authors (Non Member)* 450 USD
Listeners: 200 USD
Keynote Speaker Free
Additional Paper (s)** 320 USD
Additional Page 70 USD / One Page
Extra Proceeding 50 USD

 

  注册费 
会员作者 (IACSIT 会员)*: 2600 人民币
学生作者* 2600人民币
普通作者 (非会员)* 2800人民币
听众: 1200人民币
同一作者发表额外文章** (无额外论文集) 2200人民币
超页费用 500人民币/页
购买额外的论文集 300人民币

* One regular registration can cover a paper within 5 pages, including all figures, tables, and references.

** One regular registration with one or more additional papers has only one proceeding book.

*** For the authors who have difficulties to pay US Dollars, such as Iran, please pay Euros as: 1 Euro = 1.4 USD

**** Credit Card is not accepted by ICAMR 2011.

Good News!  Support From IACSIT

All authors can join the IACSIT for free right now, then you can register the conference as "IACSIT Member"(400 USD). Please visit the following website for more information. (http://www.iacsit.org/member.htm)

AUTHORS REGISTRATION FEE INCLUDES:

  • Participation in the technical program
  • Lunch
  • Badge
  • Conference bag and/or conference accessories
  • Conference document (proceedings on book)
  • Coffee breaks
  • Welcome reception
  • One Day Tour (Chongqing)

LISTENERS REGISTRATION FEE INCLUDES:

  • Participation in the technical program
  • Lunch
  • Badge
  • Conference bag and/or conference accessories
  • Coffee breaks
  • Welcome reception
  • One Day Tour (Chongqing)

Organizing Co-Chairs

Safaa S. Mahmoud, Ain Shams University, Egypt
S.R.Bhadra Chaudhuri, Bengal Engineering & Science University, India
Luo Zhenfei, University of Electronics Science and Technology of China, China
K.S. Aithal, Manipal University, India

International Technological Committees

Dr. Apurba Laha, Leibniz University, Germany
Prof. Yin Changyong, Shenyang Institute of Engineering (SIE), China
Dr. Shilpi Birla, Sir Padampat Singhania University, India
Dr. Mir Sadat Ali, Biju Patnaik Technical University, India
Dr. Mohan Kumar Pradhan, National Institute of Technology, Rourkela, India
Dr. VIRANJAY M. SRIVASTAVA, Jaypee Universityof Information Technology, India
Dr. Ahmed Sayed, IBM Center of Advanced Studies, Egypt
Dr. Sushmera Manikandan, National University of Singapore, Singapore
Dr. Deepak Aggarwal, BBSB Engineering College, India
Dr. Ir.David B.L.Bong, Universiti Malaysia Sarawak, Malaysia
Dr. Jaya Sil, Bengal Engineering and Science University, India
Dr. R.S. Rajesh S. Rengan, Manonmaniam Sundaranar University, India
Prof. D. Venkata Rao, Vignan’s Engineering College, India
Prof. Tanish Zaveri, Nirma University, India

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